EU REGULATION 2021/821 Annex I and IV
Dual Use Codes
N.B. For zirconium pressure tubes see 0A001.e. and for calandria tubes see 0A001.h.
Technical Note:
In 0A001.h. ‘nuclear reactor internals’ means any major structure within a reactor vessel which has one or more functions such as supporting the core, maintaining fuel alignment, directing primary coolant flow, providing radiation shields for the reactor vessel, and guiding in-core instrumentation.
Note: 0A001.i. does not control heat exchangers for the supporting systems of the reactor, e.g., the emergency cooling system or the decay heat cooling system.
Technical Note:
In 0A001.k. ‘external thermal shields’ means major structures placed over the reactor vessel which reduce heat loss from the reactor and reduce temperature within the containment vessel.
Technical Note:
In 0B001.b. ‘high strength-to-density ratio material’ means any of the following:
N.B. SEE ALSO 2A225.
N.B. SEE ALSO 6A005 AND 6A205.
N.B. SEE ALSO 6A005 AND 6A205.
N.B. SEE ALSO 3A227.
N.B. SEE ALSO 3A226.
Technical Note:
Specially designed or prepared equipment for the fabrication of "nuclear reactor" fuel elements includes equipment which:
0B006 includes:
Technical Note:
Holding or storage vessels may have the following features:
Note: 0C001 does not control the following:
Note: 0C002 does not control four "effective grammes" or less when contained in a sensing component in instruments.
N.B. SEE ALSO 1C107.
Note 1: For the purpose of export control, the competent authorities of the EU Member State in which the exporter is established will determine whether or not the exports of graphite meeting the above specifications are for "nuclear reactor" use. 0C004 does not control graphite having a purity level better than 5 ppm (parts per million) boron equivalent and with a density greater than 1,50 g/cm3 not for use in a "nuclear reactor".
Note 2: In 0C004, ‘boron equivalent’ (BE) is defined as the sum of BEz for impurities (excluding BEcarbon since carbon is not considered an impurity) including boron, where:
BEZ (ppm) = CF × concentration of element Z in ppm;
and σΒ and σΖ are the thermal neutron capture cross sections (in barns) for naturally occurring boron and element Z respectively; and AB and AZ are the atomic masses of naturally occurring boron and element Z respectively.
N.B. SEE ALSO 1A202, 9A010 and 9A110.
Note 1: 1A002 does not control "composite" structures or laminates made from epoxy resin impregnated carbon "fibrous or filamentary materials" for the repair of "civil aircraft" structures or laminates, having all of the following:
Note 2: 1A002 does not control semi-finished items, specially designed for purely civilian applications as follows:
Note 3: 1A002.b.1. does not control semi-finished items containing a maximum of two dimensions of interwoven filaments and specially designed for applications as follows:
Note 4: 1A002 does not control finished items specially designed for a specific application.
Note 5: 1A002.b.1. does not control mechanically chopped, milled, or cut carbon "fibrous or filamentary materials" 25,0 mm or less in length.
Note: 1A003 does not control manufactures when coated or laminated with copper and designed for the production of electronic printed circuit boards.
N.B. For "fusible" aromatic polyimides in any form, see 1C008.a.3.
N.B. SEE ALSO MILITARY GOODS CONTROLS, 2B351 AND 2B352.
Note: 1A004.a. includes Powered Air Purifying Respirators (PAPR) that are designed or modified for defence against agents or materials, listed in 1A004.a.
Technical Note:
For the purposes of 1A004.a.:
Technical Note:
‘Trace detection’ is defined as the capability to detect less than 1 ppm vapour, or 1 mg solid or liquid.
Note 1: 1A004.d. does not control equipment specially designed for laboratory use.
Note 2: 1A004.d. does not control non-contact walk-through security portals.
Note: 1A004 does not control:
Technical Notes:
1. 1A004 includes equipment and components that have been identified, successfully tested to national standards or otherwise proven effective, for the detection of or defence against ‘radioactive materials’, "biological agents", chemical warfare agents, ‘simulants’ or "riot control agents", even if such equipment or components are used in civil industries such as mining, quarrying, agriculture, pharmaceuticals, medical, veterinary, environmental, waste management, or the food industry.
2. ‘Simulant’ is a substance or material that is used in place of toxic agent (chemical or biological) in training, research, testing or evaluation.
3. For the purposes of 1A004, ‘radioactive materials’ are those selected or modified to increase their effectiveness in producing casualties in humans or animals, degrading equipment or damaging crops or the environment.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
N.B. For "fibrous or filamentary materials" used in the manufacture of body armour, see 1C010.
Note 1: 1A005 does not control body armour when accompanying its user for the user's own personal protection.
Note 2: 1A005 does not control body armour designed to provide frontal protection only from both fragment and blast from non-military explosive devices.
Note 3: 1A005 does not control body armour designed to provide protection only from knife, spike, needle or blunt trauma.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
Technical Note:
For the purposes of 1A006.b. ‘disruptors’ are devices specially designed for the purpose of preventing the operation of an explosive device by projecting a liquid, solid or frangible projectile.
Note: 1A006 does not control equipment when accompanying its operator.
N.B. SEE ALSO MILITARY GOODS CONTROLS, 3A229 AND 3A232.
Technical Notes:
1. The word initiator or igniter is sometimes used in place of the word detonator.
2. For the purpose of 1A007.b. the detonators of concern all utilise a small electrical conductor (bridge, bridge wire, or foil) that explosively vaporises when a fast, high-current electrical pulse is passed through it. In non-slapper types, the exploding conductor starts a chemical detonation in a contacting high explosive material such as PETN (pentaerythritoltetranitrate). In slapper detonators, the explosive vaporization of the electrical conductor drives a flyer or slapper across a gap, and the impact of the slapper on an explosive starts a chemical detonation. The slapper in some designs is driven by magnetic force. The term exploding foil detonator may refer to either an EB or a slapper-type detonator.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Technical Note:
‘Shaped charges’ are explosive charges shaped to focus the effects of the explosive blast.
N.B. SEE ALSO 9A010 AND 9A110.
Technical Note:
In 1A227 the term ‘cold area’ means the viewing area of the window exposed to the lowest level of radiation in the design application.
N.B. SEE ALSO 1B101 AND 1B201.
Note: In 1B001.b., ‘missile’ means complete rocket systems and unmanned aerial vehicle systems.
Technical Note:
For the purposes of 1B001.b., ‘tape-laying machines’ have the ability to lay one or more ‘filament bands’ limited to widths greater than 25,4 mm and less than or equal to 304,8 mm, and to cut and restart individual ‘filament band’ courses during the laying process.
Technical Note:
For the purposes of 1B001.c., the technique of interlacing includes knitting.
Technical Note:
For the purposes of 1B001.g., ‘tow-placement machines’ have the ability to place one or more ‘filament bands’ having widths less than or equal to 25,4 mm, and to cut and restart individual ‘filament band’ courses during the placement process.
Technical Notes:
1. For the purpose of 1B001, ‘primary servo positioning’ axes control, under computer program direction, the position of the end effector (i.e., head) in space relative to the work piece at the correct orientation and direction to achieve the desired process.
2. For the purposes of 1B001, a ‘filament band’ is a single continuous width of fully or partially resin-impregnated tape, tow or fibre. Fully or partially resin-impregnated ‘filament bands’ include those coated with dry powder that tacks upon heating.
N.B. SEE ALSO 1B102.
N.B. SEE ALSO 1B201.
Note: Components and accessories specified in 1B101 include moulds, mandrels, dies, fixtures and tooling for the preform pressing, curing, casting, sintering or bonding of composite structures, laminates and manufactures thereof.
Note: 1B101.d. includes rollers, tension stretchers, coating equipment, cutting equipment and clicker dies.
N.B. SEE ALSO 1B115.b.
Note: 1B102 includes:
Note: 1B115.b. does not control batch mixers, continuous mixers or fluid energy mills. For the control of batch mixers, continuous mixers and fluid energy mills see 1B117, 1B118 and 1B119.
Note 1: For equipment specially designed for the production of military goods, see the Military Goods Controls.
Note 2: 1B115 does not control equipment for the "production", handling and acceptance testing of boron carbide.
Note: In 1B117.d. the term ‘mixing/kneading shaft’ does not refer to deagglomerators or knife-spindles.
Note: 1B226 includes separators:
Technical Note:
In 1B228 ‘effective length’ means the active height of packing material in a packed-type column, or the active height of internal contactor plates in a plate-type column.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
Technical Note:
Components specially designed for target assemblies for the production of tritium may include lithium pellets, tritium getters, and specially-coated cladding.
Technical Note:
N.B. SEE ALSO 1C101.
Note 1: 1C001.a. does not control:
Technical Note:
Absorption test samples for 1C001.a. Note: 1.c.1. should be a square at least 5 wavelengths of the centre frequency on a side and positioned in the far field of the radiating element.
Technical Note:
‘Open-cell foams’ are flexible and porous materials, having an inner structure open to the atmosphere. ‘Open-cell foams’ are also known as reticulated foams.
Note 2: Nothing in Note 1 to 1C001.a. releases magnetic materials to provide absorption when contained in paint.
Materials not transparent to visible light and specially designed for absorbing near-infrared radiation having a wavelength exceeding 810 nm but less than 2 000 nm (frequencies exceeding 150 THz but less than 370 THz);
Note: 1C001.b. does not control materials, specially designed or formulated for any of the following applications:
Note: 1C001.c. does not control materials in a liquid form.
Technical Note:
‘Bulk electrical conductivity’ and ‘sheet (surface) resistivity’ should be determined using ASTM D-257 or national equivalents.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
N.B. SEE ALSO 1C202.
Note: 1C002 does not control metal alloys, metal alloy powder and alloyed materials, specially formulated for coating purposes.
Technical Notes:
1. The metal alloys in 1C002 are those containing a higher percentage by weight of the stated metal than of any other element.
2. ‘Stress-rupture life’ should be measured in accordance with ASTM standard E-139 or national equivalents.
3. ‘Low cycle fatigue life’ should be measured in accordance with ASTM standard E-606 ‘Recommended Practice for Constant-Amplitude Low-Cycle Fatigue Testing’ or national equivalents. Testing should be axial with an average stress ratio equal to 1 and a stress-concentration factor (Kt) equal to 1. The average stress ratio is defined as maximum stress minus minimum stress divided by maximum stress.
Technical Note:
X in the following equals one or more alloying elements.
Technical Notes:
1. ‘Vacuum atomisation’ is a process to reduce a molten stream of metal to droplets of a diameter of 500 μm or less by the rapid evolution of a dissolved gas upon exposure to a vacuum.
2. ‘Gas atomisation’ is a process to reduce a molten stream of metal alloy to droplets of 500 μm diameter or less by a high pressure gas stream.
3. ‘Rotary atomisation’ is a process to reduce a stream or pool of molten metal to droplets to a diameter of 500 μm or less by centrifugal force.
4. ‘Splat quenching’ is a process to ‘solidify rapidly’ a molten metal stream impinging upon a chilled block, forming a flake-like product.
5. ‘Melt spinning’ is a process to ‘solidify rapidly’ a molten metal stream impinging upon a rotating chilled block, forming a flake, ribbon or rod-like product.
6. ‘Comminution’ is a process to reduce a material to particles by crushing or grinding.
7. ‘Melt extraction’ is a process to ‘solidify rapidly’ and extract a ribbon-like alloy product by the insertion of a short segment of a rotating chilled block into a bath of a molten metal alloy.
8. ‘Mechanical alloying’ is an alloying process resulting from the bonding, fracturing and rebonding of elemental and master alloy powders by mechanical impact. Non-metallic particles may be incorporated in the alloy by addition of the appropriate powders.
9. ‘Plasma atomisation’ is a process to reduce a molten stream or solid metal to droplets of 500 μm diameter or less, using plasma torches in an inert gas environment.
10. ‘Solidify rapidly’ is a process involving the solidification of molten material at cooling rates exceeding 1 000 K/sec.
Technical Note:
Measurement of initial relative permeability must be performed on fully annealed materials.
Technical Note:
‘Nanocrystalline’ materials in 1C003.c. are those materials having a crystal grain size of 50 nm or less, as determined by X-ray diffraction.
Technical Note:
For the purpose of 1C005 ‘filaments’ may be in wire, cylinder, film, tape or ribbon form.
Note: 1C006.d. does not control materials specified and packaged as medical products.
N.B. SEE ALSO 1C107.
Technical Note:
For the purposes of 1C007, ‘precursor materials’ are special purpose polymeric or metallo-organic materials used for the "production" of silicon carbide, silicon nitride, or ceramics with silicon, carbon and nitrogen.
Note: 1C008.a. controls substances in liquid or solid "fusible" form, including resin, powder, pellet, film, sheet, tape or ribbon.
N.B. For non-"fusible" aromatic polyimides in film, sheet, tape or ribbon form, see 1A003.
Technical Notes:
1. The ‘glass transition temperature (Tg)’ for 1C008.a.2. thermoplastic materials, 1C008.a.4. materials and 1C008.f. materials is determined using the method described in ISO 11357-2:1999 or national equivalents
2. The ‘glass transition temperature (Tg)’ for 1C008.a.2. thermosetting materials and 1C008.a.3. materials is determined using the 3-point bend method described in ASTM D 7028-07 or equivalent national standard. The test is to be performed using a dry test specimen which has attained a minimum of 90 % degree of cure as specified by ASTM E 2160-04 or equivalent national standard, and was cured using the combination of standard- and post-cure processes that yield the highest Tg.
N.B. SEE ALSO 1C210 AND 9C110.
Technical Notes:
1. For the purpose of calculating "specific tensile strength", "specific modulus" or specific weight of "fibrous or filamentary materials" in 1C010.a., 1C010.b., 1C010.c. or 1C010.e.1.b., the tensile strength and modulus should be determined by using Method A described in ISO 10618:2004 or national equivalents.
2. Assessing the "specific tensile strength", "specific modulus" or specific weight of non-unidirectional "fibrous or filamentary materials" (e.g., fabrics, random mats or braids) in 1C010 is to be based on the mechanical properties of the constituent unidirectional monofilaments (e.g., monofilaments, yarns, rovings or tows) prior to processing into the non-unidirectional "fibrous or filamentary materials".
Note: 1C010.a. does not control polyethylene.
Note: 1C010.b. does not control:
Note: 1C010.c. does not control:
Technical Note:
‘Commingled’ is filament to filament blending of thermoplastic fibres and reinforcement fibres in order to produce a fibre reinforcement "matrix" mix in total fibre form.
Note 1: Metal or carbon-coated "fibrous or filamentary materials" (preforms) or ‘carbon fibre preforms’, not impregnated with resin or pitch, are specified by "fibrous or filamentary materials" in 1C010.a., 1C010.b. or 1C010.c.
Note 2: 1C010.e. does not control:
Technical Notes:
1. ‘Carbon fibre preforms’ are an ordered arrangement of uncoated or coated fibres intended to constitute a framework of a part before the "matrix" is introduced to form a "composite".
2. The ‘Dynamic Mechanical Analysis glass transition temperature (DMA Tg)’ for materials specified in 1C010.e. is determined using the method described in ASTM D 7028-07, or equivalent national standard, on a dry test specimen. In the case of thermoset materials, degree of cure of a dry test specimen shall be a minimum of 90 % as defined by ASTM E 2160-04 or equivalent national standard.
N.B. SEE ALSO MILITARY GOODS CONTROLS AND 1C111.
Technical Note:
The natural content of hafnium in the zirconium (typically 2 % to 7 %) is counted with the zirconium.
Note: The metals or alloys specified in 1C011.a. are controlled whether or not the metals or alloys are encapsulated in aluminium, magnesium, zirconium or beryllium.
Note: The metals or alloys specified in 1C011.b. are controlled whether or not the metals or alloys are encapsulated in aluminium, magnesium, zirconium or beryllium.
N.B. See also Military Goods Controls for metal powders mixed with other substances to form a mixture formulated for military purposes.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Technical Note:
These materials are typically used for nuclear heat sources.
Note: 1C012.a. does not control:
Note: 1C012.b. does not control shipments with a neptunium-237 content of 1 g or less.
Note 1: 1C101 includes:
Note 2: 1C101 does not include coatings when specially used for the thermal control of satellites.
Technical Note:
In 1C101 ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
N.B. See also 0C004.
N.B. See also 0C004.
Note: 1C107.f. does not control ‘Ultra High Temperature Ceramic (UHTC) ’ materials in non-composite form.
Technical Note 1:
In 1C107.f. ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Technical Note 2:
‘Ultra High Temperature Ceramics (UHTC)’ includes:
Technical Note:
A particle size of 63 μm (ISO R-565) corresponds to 250 mesh (Tyler) or 230 mesh (ASTM standard E-11).
Technical Note:
The natural content of hafnium in the zirconium (typically 2 % to 7 %) is counted with the zirconium.
Note: 1C111a.2.a. and 1C111a.2.b. controls powder mixtures with a multimodal particle distribution (e.g. mixtures of different grain sizes) if one or more modes are controlled.
Technical Note:
Mixed Oxides of Nitrogen (MON) are solutions of Nitric Oxide (NO) in Dinitrogen Tetroxide/Nitrogen Dioxide (N2O4/NO2) that can be used in missile systems. There are a range of compositions that can be denoted as MONi or MONij, where i and j are integers representing the percentage of Nitric Oxide in the mixture (e.g., MON3 contains 3 % Nitric Oxide, MON25 25 % Nitric Oxide. An upper limit is MON40, 40 % by weight).
N.B. SEE ALSO MILITARY GOODS CONTROLS.
Note: 1C111.a.5.b. does not control fossil refined fuels and biofuels produced from vegetables, including fuels for engines certified for use in civil aviation, unless specially formulated for ‘missiles’ or unmanned aerial vehicles specified in 9A012 or 9A112.a..
Technical Note:
In 1C111.a.5. ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Technical Note:
Polytetrahydrofuran polyethylene glycol (TPEG) is a block co-polymer of poly 1,4-Butanediol (CAS 110-63-4) and polyethylene glycol (PEG) (CAS 25322-68-3).
Note: 1C111.c.6.o. does not control ferrocene derivatives that contain a six carbon aromatic functional group attached to the ferrocene molecule.
Technical Notes:
1. In 1C111.d. a ‘gel propellant’ is a fuel or oxidiser formulation using a gellant such as silicates, kaolin (clay), carbon or any polymeric gellant.
2. In 1C111.d. a ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Note: For propellants and constituent chemicals for propellants not specified in 1C111, see the Military Goods Controls.
N.B. SEE ALSO 1C216.
Technical Note 1:
Maraging steels are iron alloy:
Technical Note 2:
In 1C116 ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Technical Note:
In 1C117 ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Technical Note:
The phrase alloys ‘capable of’ encompasses alloys before or after heat treatment.
Note: 1C210.a. does not control aramid ‘fibrous or filamentary materials’ having 0,25 % by weight or more of an ester based fibre surface modifier;
Technical Note:
The resin forms the matrix of the composite.
Note: In 1C210, ‘fibrous or filamentary materials’ is restricted to continuous "monofilaments", "yarns", "rovings", "tows" or "tapes".
Note: 1C216 does not control forms in which all linear dimensions are 75 mm or less.
Technical Note:
The phrase maraging steel ‘capable of’ encompasses maraging steel before or after heat treatment.
Note: In 1C225 mixtures containing boron include boron loaded materials.
Technical Note:
The natural isotopic abundance of boron-10 is approximately 18,5 weight per cent (20 atom per cent).
Note: 1C226 does not control manufactures specially designed as weights or gamma-ray collimators.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
Note: 1C230 does not control the following:
Note: 1C232 does not control a product or device containing less than 1 g of helium-3.
Note: 1C233 does not control thermoluminescent dosimeters.
Technical Note:
The natural isotopic abundance of lithium-6 is approximately 6,5 weight per cent (7,5 atom per cent).
Note: 1C234 does not control zirconium in the form of foil having a thickness of 0,10 mm or less.
Note: 1C235 does not control a product or device containing less than 1,48 × 103 GBq (40 Ci) of tritium.
Note: 1C236 does not control a product or device containing less than 3,7 GBq (100 millicuries) of activity.
Technical Note:
In 1C236 ‘radionuclides’ are any of the following:
Note: 1C237 does not control the following:
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Note: 1C240 does not control the following:
Technical Note:
1C240.b. refers to porous metal formed by compacting and sintering the materials in 1C240.a. to form a metal material with fine pores interconnected throughout the structure.
N.B. SEE ALSO MILITARY GOODS CONTROLS AND 1C450.
Note 1: For exports to "States not Party to the Chemical Weapons Convention", 1C350 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C350.1, .3, .5, .11, .12, .13, .17, .18, .21, .22, .26, .27, .28, .31, .32, .33, .34, .35, .36, .54, .55, .56, .57, .63 and .65 in which no individually specified chemical constitutes more than 10 % by the weight of the mixture.
Note 2: For exports to "States Party to the Chemical Weapons Convention", 1C350 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C350.1, .3, .5, .11, .12, .13, .17, .18, .21, .22, .26, .27, .28, .31, .32, .33, .34, .35, .36, .54, .55, .56, .57, .63 and .65 in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 3: 1C350 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C350.2, .6, .7, .8, .9, .10, .14, .15, .16, .19, .20, .24, .25, .30, .37, .38, .39, .40, .41, .42, .43, .44, .45, .46, .47, .48, .49, .50, .51, .52, .53, .58, .59, .60, .61, .62, .64, .66, .67, .68, .69, .70, .71, .72, .73, .74, .75, .76, .77, .78, .79, .80, .81, .82, .83, .84, .85, .86, .87, .88 and .89 in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 4: 1C350 does not control products identified as consumer goods packaged for retail sale for personal use or packaged for individual use.
Note: Shiga toxin producing Escherichia coli (STEC) includes inter alia enterohaemorrhagic E. coli (EHEC), verotoxin producing E. coli (VTEC) or verocytotoxin producing E. coli (VTEC).
Note: 1C351.d. does not control botulinum toxins or conotoxins in product form meeting all of the following criteria:
Note: 1C351 does not control "vaccines" or "immunotoxins".
Technical Notes:
1. ‘Genetically-modified organisms’ include organisms in which the nucleic acid sequences have been created or altered by deliberate molecular manipulation.
2. ‘Genetic elements’ include inter alia chromosomes, genomes, plasmids, transposons, vectors and inactivated organisms containing recoverable nucleic acid fragments, whether genetically modified or unmodified, or chemically synthesised in whole or in part. For the purposes of the genetic elements control, nucleic acids from an inactivated organism, virus, or sample are considered recoverable if the inactivation and preparation of the material is intended or known to facilitate isolation, purification, amplification, detection, or identification of nucleic acids.
3. ‘Endow or enhance pathogenicity’ is defined as when the insertion or integration of the nucleic acid sequence or sequences is/are likely to enable or increase a recipient organism’s ability to be used to deliberately cause disease or death. This might include alterations to, inter alia: virulence, transmissibility, stability, route of infection, host range, reproducibility, ability to evade or suppress host immunity, resistance to medical countermeasures, or detectability.
Note 1: 1C353 does not control nucleic acid sequences of shiga toxin producing Escherichia coli of serogroups O26, O45, O103, O104, O111, O121, O145, O157, and other shiga toxin producing serogroups, other than those genetic elements coding for shiga toxin, or for its subunits.
Note 2: 1C353 does not control "vaccines".
N.B. SEE ALSO ENTRY 1C350, 1C351.d. AND MILITARY GOODS CONTROLS.
Note 1: For exports to "States not Party to the Chemical Weapons Convention", 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C450.a.1. and .a.2. in which no individually specified chemical constitutes more than 1 % by the weight of the mixture.
Note 2: For exports to "States Party to the Chemical Weapons Convention", 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C450.a.1. and .a.2. in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 3: 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C450.a.4., .a.5., .a.6. and .a.7. in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 4: 1C450 does not control products identified as consumer goods packaged for retail sale for personal use or packaged for individual use.
Note: 1C450.b.1. does not control Fonofos: O-Ethyl S-phenyl ethylphosphonothiolothionate (CAS 944-22-9);
N.B. See 1C350.57. for N,N-Dimethylaminophosphoryl dichloride.
Note: 1C450.b.5. does not control the following:
Note 1: For exports to "States not Party to the Chemical Weapons Convention", 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C450.b.1., .b.2., .b.3., .b.4., .b.5. and .b.6. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture.
Note 2: For exports to "States Party to the Chemical Weapons Convention", 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entries 1C450.b.1., .b.2., .b.3., .b.4., .b.5. and .b.6. in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 3: 1C450 does not control "chemical mixtures" containing one or more of the chemicals specified in entry 1C450.b.8. in which no individually specified chemical constitutes more than 30 % by the weight of the mixture.
Note 4: 1C450 does not control products identified as consumer goods packaged for retail sale for personal use or packaged for individual use.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Note: 1E002.c.2. does not control "technology" for abrasives.
Note: 1E002.f. does not control "technology" for the repair of "civil aircraft" structures using carbon "fibrous or filamentary materials" and epoxy resins, contained in "aircraft" manufacturers' manuals.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Note: 1E104 includes "technology" for the composition of precursor gases, flow-rates and process control schedules and parameters.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
N.B. For quiet running bearings, see the Military Goods Controls.
N.B. SEE ALSO 2A101.
Note: 2A001.a. does not control tapered roller bearings.
Technical Notes:
1. ‘Ring’ - annular part of a radial rolling bearing incorporating one or more raceways (ISO 5593:1997).
2. ‘Rolling element’ - ball or roller which rolls between raceways (ISO 5593:1997).
Technical Note:
For valves with different inlet and outlet diameters, the ‘nominal size’ in 2A226 refers to the smallest diameter.
Technical Notes:
1. Secondary parallel contouring axes, (e.g., the w-axis on horizontal boring mills or a secondary rotary axis the centre line of which is parallel to the primary rotary axis) are not counted in the total number of contouring axes. Rotary axes need not rotate over 360o. A rotary axis can be driven by a linear device (e.g., a screw or a rack-and-pinion).
2. For the purposes of 2B, the number of axes which can be co-ordinated simultaneously for "contouring control" is the number of axes along or around which, during processing of the workpiece, simultaneous and interrelated motions are performed between the workpiece and a tool. This does not include any additional axes along or around which other relative movement within the machine are performed such as:
3. Axis nomenclature shall be in accordance with International Standard ISO 841:2001, Industrial automation systems and integration - Numerical control of machines - Coordinate system and motion nomenclature.
4. For the purposes of 2B001 to 2B009 a "tilting spindle" is counted as a rotary axis.
5. ‘Stated "unidirectional positioning repeatability"’ may be used for each machine tool model as an alternative to individual machine tests and is determined as follows:
) become the stated value of each axis for the model (
,
…);
6. For the purposes of 2B001.a. to 2B001.c., measurement uncertainty for the "unidirectional positioning repeatability" of machine tools, as defined in the International Standard ISO 230-2:2014 or national equivalents, shall not be considered.
7. For the purpose of 2B001.a. to 2B001.c., the measurement of axes shall be made according to test procedures in 5.3.2. of ISO 230-2:2014. Tests for axes longer than 2 meters shall be made over 2 m segments. Axes longer than 4 m require multiple tests (e.g., two tests for axes longer than 4 m and up to 8 m, three tests for axes longer than 8 m and up to 12 m), each over 2 m segments and distributed in equal intervals over the axis length. Test segments are equally spaced along the full axis length, with any excess length equally divided at the beginning, in between, and at the end of the test segments. The smallest "unidirectional positioning repeatability"-value of all test segments is to be reported.
N.B. SEE ALSO 2B201.
Note 1: 2B001 does not control special purpose machine tools limited to the manufacture of gears. For such machines see 2B003.
Note 2: 2B001 does not control special purpose machine tools limited to the manufacture of any of the following:
Note 3: A machine tool having at least two of the three turning, milling or grinding capabilities (e.g., a turning machine with milling capability), must be evaluated against each applicable entry 2B001.a., b. or c.
Note 4: A machine tool having an additive manufacturing capability in addition to a turning, milling or grinding capability must be evaluated against each applicable entry 2B001.a., .b. or .c.
N.B. For optical finishing machines, see 2B002.
Note 1: 2B001.a. does not control turning machines specially designed for producing contact lenses, having all of the following:
Note 2: 2B001.a. does not control bar machines (Swissturn), limited to machining only bar feed thru, if maximum bar diameter is equal to or less than 42 mm and there is no capability of mounting chucks. Machines may have drilling or milling capabilities for machining parts with diameters less than 42 mm.
a. "Unidirectional positioning repeatability" equal to or less (better) than 0,9 μm along one or more linear axis with a travel length less than 1,0 m; or
Note: 2B001.c. does not control grinding machine as follows:
Technical Notes:
For the purposes of 2B002:
1. ‘MRF’ is a material removal process using an abrasive magnetic fluid whose viscosity is controlled by a magnetic field.
2. ‘ERF’ is a removal process using an abrasive fluid whose viscosity is controlled by an electric field.
3. ‘Energetic particle beam finishing’ uses Reactive Atom Plasmas (RAP) or ion-beams to selectively remove material.
4. ‘Inflatable membrane tool finishing’ is a process that uses a pressurized membrane that deforms to contact the workpiece over a small area.
5. ‘Fluid jet finishing’ makes use of a fluid stream for material removal.
N.B. SEE ALSO 2B104 and 2B204
Technical Note:
The inside chamber dimension is that of the chamber in which both the working temperature and the working pressure are achieved and does not include fixtures. That dimension will be the smaller of either the inside diameter of the pressure chamber or the inside diameter of the insulated furnace chamber, depending on which of the two chambers is located inside the other.
N.B. For specially designed dies, moulds and tooling see 1B003, 9B009 and the Military Goods Controls.
N.B. SEE ALSO 2B105.
Note: 2B005 does not control chemical vapour deposition, cathodic arc, sputter deposition, ion plating or ion implantation equipment, specially designed for cutting or machining tools.
Technical Note:
The E0,MPE of the most accurate configuration of the CMM specified by the manufacturer (e.g., best of the following: probe, stylus length, motion parameters, environment) and with "all compensations available" shall be compared to the 1,7+L/1 000 μm threshold.
N.B. SEE ALSO 2B206.
Note: Interferometer and optical-encoder measuring systems containing a "laser" are only specified in 2B006.b.3 and 2B206.c.
Technical Notes:
For the purposes of 2B006.b.1.:
1. ‘non-contact type measuring systems’ are designed to measure the distance between the probe and measured object along a single vector, where the probe or measured object is in motion.
2. ‘measuring range’ means the distance between the minimum and maximum working distance.
Note: 2B006.c. does not control optical instruments, such as autocollimators, using collimated light (e.g. "laser" light) to detect angular displacement of a mirror.
Note: 2B006 includes machine tools, other than those specified in 2B001, that can be used as measuring machines if they meet or exceed the criteria specified for the measuring machine function.
N.B. SEE ALSO 2B207.
Note: 2B007.b. does not control "robots" specially designed for paint-spraying booths.
Technical Note:
The term Gy (silicon) refers to the energy in Joules per kilogram absorbed by an unshielded silicon sample when exposed to ionising radiation.
Technical Note:
A ‘compound rotary table’ is a table allowing the workpiece to rotate and tilt about two non-parallel axes
N.B. SEE ALSO 2B109 AND 2B209.
Technical Note:
For the purpose of 2B009, machines combining the function of spin-forming and flow-forming are regarded as flow-forming machines.
N.B. SEE ALSO 2B204.
N.B. SEE ALSO 2B209.
Technical Note:
Machines combining the function of spin-forming and flow-forming are for the purpose of 2B109 regarded as flow-forming machines.
Technical Note:
In 2B116.b., ‘real-time control bandwidth’ means the maximum rate at which a controller can execute complete cycles of sampling, processing data and transmitting control signals.
Technical Note:
In 2B116, ‘bare table’ means a flat table, or surface, with no fixture or fittings.
N.B. SEE ALSO 2B219.
Note: 2B119.a. does not control balancing machines designed or modified for dental or other medical equipment.
Technical Note:
Indicator heads are sometimes known as balancing instrumentation.
a. Capable of rates of 400 degrees/s or more, or 30 degrees/s or less; and
Note 1: 2B120 does not control rotary tables designed or modified for machine tools or for medical equipment. For controls on machine tool rotary tables see 2B008.
Note 2: Motion simulators or rate tables specified in 2B120 remain controlled whether or not slip rings or integrated non-contact devices are fitted at time of export.
Note: 2B121 does not control rotary tables designed or modified for machine tools or for medical equipment. For controls on machine tool rotary tables see 2B008.
Note: Centrifuges specified in 2B122 remain controlled whether or not slip rings or integrated non-contact devices are fitted at time of export.
Technical Note :
Stated positioning accuracy levels derived under the following procedures from measurements made according to ISO 230-2:1988 ( 9 )or national equivalents may be used for each machine tool model if provided to, and accepted by, national authorities instead of individual machine tests. Determination of stated positioning accuracy:
Note: 2B201.a. does not control milling machines having the following characteristics:
Note: 2B201.b. does not control grinding machines as follows:
Note: 2B201.c. does not control bar machines (Swissturn), limited to machining only bar feed thru, if maximum bar diameter is equal to or less than 42 mm and there is no capability of mounting chucks. Machines may have drilling and/or milling capabilities for machining parts with diameters less than 42 mm.
Note 1: 2B201 does not control special purpose machine tools limited to the manufacture of any of the following parts:
Note 2: A machine tool having at least two of the three turning, milling or grinding capabilities (e.g., a turning machine with milling capability), must be evaluated against each applicable entry 2B201.a., .b. or .c.
Note 3: 2B201.a.3. and 2B201.b.3. include machines based on a parallel linear kinematic design (e.g., hexapods) that have 5 or more axes none of which is a rotary axis.
Technical Note:
In 2B204 the inside chamber dimension is that of the chamber in which both the working temperature and the working pressure are achieved and does not include fixtures. That dimension will be the smaller of either the inside diameter of the pressure chamber or the inside diameter of the insulated furnace chamber, depending on which of the two chambers is located inside the other.
Technical Note:
The E0,MPE of the most accurate configuration of the CMM specified according to ISO 10360-2:2009 by the manufacturer (e.g., best of the following: probe, stylus, length, motion parameters, environments) and with all compensations available shall be compared to the (1,7 + L/800) μm threshold.
Technical Note:
For the purpose of 2B206.c. ‘linear displacement’ means the change of distance between the measuring probe and the measured object.
Note: 2B206.c. does not control measuring interferometer systems, without closed or open loop feedback, containing a laser to measure slide movement errors of machine tools, dimensional inspection machines, or similar equipment.
Technical Note:
For the purpose of 2B206.d. ‘linear displacement’ means the change of distance between the measuring probe and the measured object.
Note 1: Machine tools that can be used as measuring machines are controlled if they meet or exceed the criteria specified for the machine tool function or the measuring machine function.
Note 2: A machine specified in 2B206 is controlled if it exceeds the control threshold anywhere within its operating range.
Technical Notes:
All parameters of measurement values in 2B206 represent plus/minus i.e., not total band.
Note: 2B209.a. includes machines which have only a single roller designed to deform metal plus two auxiliary rollers which support the mandrel, but do not participate directly in the deformation process.
Technical Note:
Remote manipulators provide translation of human operator actions to a remote operating arm and terminal fixture. They may be of ‘master/slave’ type or operated by joystick or keypad.
N.B. SEE ALSO 3B001 and 9B001.
Note: 2B226.a. does not control furnaces designed for the processing of semiconductor wafers.
Note: 2B228.a. includes precision mandrels, clamps, and shrink fit machines.
Technical Note:
In 2B228.b. such equipment normally consists of precision measuring probes linked to a computer that subsequently controls the action of, for example, pneumatic rams used for aligning the rotor tube sections.
Bellows-forming mandrels and dies for producing single-convolution bellows.
Technical Note:
In 2B228.c. the bellows have all of the following characteristics:
Technical Notes:
1. In 2B230 ‘pressure transducer’ means a device that converts a pressure measurement into a signal.
2. For the purposes of 2B230, ‘accuracy’ includes non-linearity, hysteresis and repeatability at ambient temperature.
Technical Notes:
1. The pumping speed is determined at the measurement point with nitrogen gas or air.
2. The ultimate vacuum is determined at the input of the pump with the input of the pump blocked off.
N.B. SEE ALSO MILTARY GOODS CONTROLS.
N.B. SEE ALSO 2B350.i.
N.B. For prefabricated repair assemblies, see 2B350.k.
N.B. For prefabricated repair assemblies, see 2B350.k.
Technical Notes:
1. For the purposes of 2B350.g., ‘corrosion resistant materials’ means any of the following materials:
2. The ‘nominal size’ is defined as the smaller of the inlet and outlet diameters.
3. Nominal sizes (DN) of valves are in accordance with ISO 6708:1995. Nominal Pipe Sizes (NPS) are in accordance with ASME B36.10 or B36.19 or national equivalents.
Technical Note:
In 2B350.i., the term seal refers to only those seals that come into direct contact with the chemical(s) being processed (or are designed to), and provide a sealing function where a rotary or reciprocating drive shaft passes through a pump body.
Note: For the purposes of 2B350, the materials used for gaskets, packing, seals, screws, washers or other materials performing a sealing function do not determine the status of control, provided that such components are designed to be interchangeable.
Technical Notes:
1. ‘Carbon graphite’ is a composition consisting of amorphous carbon and graphite, in which the graphite content is eight percent or more by weight.
2. For the listed materials in the above entries, the term ‘alloy’ when not accompanied by a specific elemental concentration is understood as identifying those alloys where the identified metal is present in a higher percentage by weight than any other element.
Technical Notes:
1. For the purposes of 2B352.b. fermenters include bioreactors, single-use (disposable) bioreactors, chemostats and continuous-flow systems.
2. Cultivation chamber holding devices include single-use cultivation chambers with rigid walls.
Technical Note:
Centrifugal separators include decanters.
Technical Note:
In 2B352.d.1.b. sterilised denotes the elimination of all viable microbes from the equipment through the use of either physical (e.g. steam) or chemical agents. Disinfected denotes the destruction of potential microbial infectivity in the equipment through the use of chemical agents with a germicidal effect. Disinfection and sterilisation are distinct from sanitisation, the latter referring to cleaning procedures designed to lower the microbial content of equipment without necessarily achieving elimination of all microbial infectivity or viability.
Note: 2B352.d. does not control reverse osmosis and hemodialysis equipment, as specified by the manufacturer.
Note: 2B352.f.1. does not control suits designed to be worn with self-contained breathing apparatus.
Note 1: 2B352.f.2. includes Class III biosafety cabinets, as described in the latest edition of the WHO Laboratory Biosafety Manual or constructed in accordance with national standards, regulations or guidance.
Note 2: 2B352.f.2. includes any isolator meeting all of the above mentioned characteristics, regardless of its intended use and its designation.
Note 3: 2B352.f.2. does not include isolators specially designed for barrier nursing or transportation of infected patients.
None
Note: 2D001 does not control part programming "software" that generates "numerical control" codes for machining various parts.
Note 1: 2D002 does not control "software" specially designed or modified for the operation of items not specified in Category 2.
Note 2: 2D002 does not control "software" for items specified in 2B002. See 2D001 and 2D003 for "software" for items specified in 2B002.
Note 3: 2D002 does not control "software" that is exported with, and the minimum necessary for the operation of, items not specified in Category 2.
Note: 2D202 does not control part programming "software" that generates "numerical control" command codes but does not allow direct use of equipment for machining various parts.
Note: 2E001 includes "technology" for the integration of probe systems into coordinate measurement machines specified in 2B006.a.
Note: The table and Technical Note appear after entry 2E301.
N.B. This table should be read to specify the "technology" for a particular Coating Process only when the Resultant Coating in column 3 is in a paragraph directly across from the relevant Substrate under column 2. For example, Chemical Vapour Deposition (CVD) coating process technical data are included for the application of silicides to carbon-carbon, ceramic and metal "matrix" "composites" substrates, but are not included for the application of silicides to ‘cemented tungsten carbide’ (16), ‘silicon carbide’ (18) substrates. In the second case, the resultant coating is not listed in the paragraph under column 3 directly across from the paragraph under column 2 listing ‘cemented tungsten carbide’ (16), ‘silicon carbide’ (18).
Table
Deposition techniques
1. Coating Process (1) (*1) |
2. Substrate |
3. Resultant Coating |
A. Chemical Vapour Deposition (CVD) |
"Superalloys" |
Aluminides for internal passages |
|
Ceramics (19) and Low expansion glasses (14) |
Silicides Carbides Dielectric layers (15) Diamond Diamond-like carbon (17) |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Aluminides Alloyed aluminides (2) Boron nitride |
|
Cemented tungsten carbide (16), Silicon carbide (18) |
Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) |
|
Molybdenum and Molybdenum alloys |
Dielectric layers (15) |
|
Beryllium and Beryllium alloys |
Dielectric layers (15) Diamond Diamond-like carbon (17) |
|
Sensor window materials (9) |
Dielectric layers (15) Diamond Diamond-like carbon (17) |
B. Thermal-Evaporation Physical Vapour Deposition (TE-PVD) |
|
|
B.1. Physical Vapour Deposition (PVD): Electron-Beam (EB-PVD) |
"Superalloys" |
Alloyed silicides Alloyed aluminides (2) MCrAlX (5) Modified zirconia (12) Silicides Aluminides Mixtures thereof (4) |
|
Ceramics (19) and Low expansion glasses (14) |
Dielectric layers (15) |
|
Corrosion resistant steel (7) |
MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Boron nitride |
|
Cemented tungsten carbide (16), Silicon carbide (18) |
Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) |
|
Molybdenum and Molybdenum alloys |
Dielectric layers (15) |
|
Beryllium and Beryllium alloys |
Dielectric layers (15) Borides Beryllium |
|
Sensor window materials (9) |
Dielectric layers (15) |
|
Titanium alloys (13) |
Borides Nitrides |
B.2. Ion assisted resistive heating Physical Vapour Deposition (PVD) (Ion Plating) |
Ceramics (19) and Low-expansion glasses |
Dielectric layers (15) Diamond-like carbon (17) |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Dielectric layers (15) |
|
Cemented tungsten carbide (16), Silicon carbide |
Dielectric layers (15) |
|
Molybdenum and Molybdenum alloys |
Dielectric layers (15) |
|
Beryllium and Beryllium alloys |
Dielectric layers (15) |
|
Sensor window materials (9) |
Dielectric layers (15) Diamond-like carbon (17) |
B.3. Physical Vapour Deposition (PVD): "Laser" Vaporization |
Ceramics (19) and Low expansion glasses (14) |
Silicides Dielectric layers (15) Diamond-like carbon (17) |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Dielectric layers (15) |
|
Cemented tungsten carbide (16), Silicon carbide |
Dielectric layers (15) |
|
Molybdenum and Molybdenum alloys |
Dielectric layers (15) |
|
Beryllium and Beryllium alloys |
Dielectric layers (15) |
|
Sensor window materials (9) |
Dielectric layers (15) Diamond-like carbon (17) |
B.4. Physical Vapour Deposition (PVD): Cathodic Arc Discharge |
"Superalloys" |
Alloyed silicides Alloyed aluminides (2) MCrAlX (5) |
|
Polymers (11) and Organic "matrix" "composites" |
Borides Carbides Nitrides Diamond-like carbon (17) |
C. Pack cementation (see A above for out-of-pack cementation) (10) |
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Silicides Carbides Mixtures thereof (4) |
|
Titanium alloys (13) |
Silicides Aluminides Alloyed aluminides (2) |
|
Refractory metals and alloys (8) |
Silicides Oxides |
D. Plasma spraying |
"Superalloys" |
MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) Abradable Nickel-Graphite Abradable materials containing Ni-Cr-Al Abradable Al-Si-Polyester Alloyed aluminides (2) |
|
Aluminium alloys (6) |
MCrAlX (5) Modified zirconia (12) Silicides Mixtures thereof (4) |
|
Refractory metals and alloys (8) |
Aluminides Silicides Carbides |
|
Corrosion resistant steel (7) |
MCrAlX (5) Modified zirconia (12) Mixtures thereof (4) |
|
Titanium alloys (13) |
Carbides Aluminides Silicides Alloyed aluminides (2) Abradable Nickel-Graphite Abradable materials containing Ni-Cr-Al Abradable Al-Si-Polyester |
E. Slurry Deposition |
Refractory metals and alloys (8) |
Fused silicides Fused aluminides except for resistance heating elements |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Silicides Carbides Mixtures thereof (4) |
F. Sputter Deposition |
"Superalloys" |
Alloyed silicides Alloyed aluminides (2) Noble metal modified aluminides (3) MCrAlX (5) Modified zirconia (12) Platinum Mixtures thereof (4) |
|
Ceramics and Low - expansion glasses (14) |
Silicides Platinum Mixtures thereof (4) Dielectic layers (15) Diamond-like carbon (17) |
|
Titanium alloys (13) |
Borides Nitrides Oxides Silicides Aluminides Alloyed aluminides (2) Carbides |
|
Carbon-carbon, Ceramic and Metal "matrix" "composites" |
Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Boron nitride |
|
Cemented tungsten carbide (16), Silicon carbide (18) |
Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) Boron nitride |
|
Molybdenum and Molybdenum alloys |
Dielectric layers (15) |
|
Beryllium and Beryllium alloys |
Borides Dielectric layers (15) Beryllium |
|
Sensor window materials (9) |
Dielectric layers (15) Diamond-like carbon (17) |
|
Refractory metals and alloys (8) |
Aluminides Silicides Oxides Carbides |
G. Ion Implantation |
High temperature bearing steels |
Additions of Chromium Tantalum or Niobium (Columbium) |
|
Titanium alloys (13) |
Borides Nitrides |
|
Beryllium and Beryllium alloys |
Borides |
|
Cemented tungsten carbide (16) |
Carbides Nitrides |
TABLE - DEPOSITION TECHNIQUES - NOTES
magnetic disk drives and heads, equipment for the manufacture of disposables, valves for faucets, acoustic diaphragms for speakers, engine parts for automobiles, cutting tools, punching-pressing dies, office automation equipment, microphones or medical devices or moulds, for casting or moulding of plastics, manufactured from alloys containing less than 5 % beryllium.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table are defined as follows:
N.B.1 CVD includes the following processes: directed gas flow out-of-pack deposition, pulsating CVD, controlled nucleation thermal deposition (CNTD), plasma enhanced or plasma assisted CVD processes.
N.B.2 Pack denotes a substrate immersed in a powder mixture.
N.B.3 The gaseous reactants used in the out-of-pack process are produced using the same basic reactions and parameters as the pack cementation process, except that the substrate to be coated is not in contact with the powder mixture.
The addition of gases to the vacuum chamber during the coating process to synthesise compound coatings is an ordinary modification of the process.
The use of ion or electron beams, or plasma, to activate or assist the coating's deposition is also a common modification in this technique. The use of monitors to provide in-process measurement of optical characteristics and thickness of coatings can be a feature of these processes.
Specific TE-PVD processes are as follows:
The substrate and powder mixture is contained within a retort which is heated to between 1 030 K (757 °C) and 1 375 K (1 102 °C) for sufficient time to deposit the coating.
N.B.1 Low pressure means less than ambient atmospheric pressure.
N.B.2 High velocity refers to nozzle-exit gas velocity exceeding 750 m/s calculated at 293 K (20 °C) at 0,1 MPa.
N.B.1 The Table refers only to triode, magnetron or reactive sputter deposition which is used to increase adhesion of the coating and rate of deposition and to radio frequency (RF) augmented sputter deposition used to permit vaporisation of non-metallic coating materials.
N.B.2 Low-energy ion beams (less than 5 keV) can be used to activate the deposition.
Note 1: The control status of equipment and components described in 3A001 or 3A002, other than those described in 3A001.a.3. to 3A001.a.10., or 3A001.a.12. to 3A001.a.14., which are specially designed for or which have the same functional characteristics as other equipment is determined by the control status of the other equipment.
Note 2: The control status of integrated circuits described in 3A001.a.3. to 3A001.a.9., or 3A001.a.12. to 3A001.a.14., which are unalterably programmed or designed for a specific function for another equipment is determined by the control status of the other equipment.
N.B. When the manufacturer or applicant cannot determine the control status of the other equipment, the control status of the integrated circuits is determined in 3A001.a.3. to 3A001.a.9., and 3A001.a.12. to 3A001.a.14.
Note 3: The status of wafers (finished or unfinished), in which the function has been determined, is to be evaluated against the parameters of 3A001.a., 3A001.b., 3A001.d., 3A001.e.4., 3A001.g., 3A001.h., or 3A001.i.
Note: Integrated circuits include the following types:
Note: 3A001.a.1.c. does not control Metal Insulator Semiconductors (MIS).
Note: 3A001.a.2. does not control integrated circuits designed for civil automobiles or railway train applications.
Technical Note:
‘Non-volatile memories’ are memories with data retention over a period of time after a power shutdown.
Note: 3A001.a.3. includes digital signal processors, digital array processors and digital coprocessors.
N.B. SEE ALSO 3A101
N.B. For integrated circuits that contain analogue-to-digital converters and store or process the digitised data, see 3A001.a.14.
Technical Notes:
1. A resolution of n bit corresponds to a quantisation of 2n levels.
2. The resolution of the ADC is the number of bits of the digital output that represents the measured analogue input. Effective Number of Bits (ENOB) is not used to determine the resolution of the ADC.
3. For "multiple channel ADCs", the "sample rate" is not aggregated and the "sample rate" is the maximum rate of any single channel.
4. For "interleaved ADCs" or for "multiple channel ADCs" that are specified to have an interleaved mode of operation, the "sample rates" are aggregated and the "sample rate" is the maximum combined total rate of all of the interleaved channels.
b. An ‘adjusted update rate’ exceeding 3 500 MSPS;
Technical Notes:
1. ‘Spurious Free Dynamic Range’ (SFDR) is defined as the ratio of the RMS value of the carrier frequency (maximum signal component) at the input of the DAC to the RMS value of the next largest noise or harmonic distortion component at its output.
2. SFDR is determined directly from the specification table or from the characterisation plots of SFDR versus frequency.
3. A signal is defined to be full scale when its amplitude is greater than -3 dBfs (full scale).
4. ‘Adjusted update rate’ for DACs:
Note: 3A001.a.7. includes:
N.B. For integrated circuits having field programmable logic devices that are combined with an analogue-to-digital converter, see 3A001.a.14.
Technical Notes:
1. Maximum number of digital input/outputs in 3A001.a.7.a. is also referred to as the maximum user input/outputs or maximum available input/outputs, whether the integrated circuit is packaged or bare die.
2. ‘Aggregate one-way peak serial transceiver data rate’ is the product of the peak serial one-way transceiver data rate times the number of transceivers on the FPGA.
Technical Note:
When N is equal to 1 024 points, the formula in 3A001.a.12. gives an execution time of 500 μs.
Technical Note:
The DAC clock frequency may be specified as the master clock frequency or the input clock frequency.
N.B.1. For analogue-to-digital converter integrated circuits see 3A001.a.5.a.
N.B.2. For field programmable logic devices see 3A001.a.7.
Technical Notes:
1. A resolution of n bit corresponds to a quantisation of 2 n levels.
2. The resolution of the ADC is the number of bits of the digital output of the ADC that represents the measured analogue input. Effective Number of Bits (ENOB) is not used to determine the resolution of the ADC.
3. For integrated circuits with non-interleaving "multiple channel ADCs", the "sample rate" is not aggregated and the "sample rate" is the maximum rate of any single channel.
4. For integrated circuits with "interleaved ADCs "or with "multiple channel ADCs" that are specified to have an interleaved mode of operation, the "sample rates" are aggregated and the "sample rate" is the maximum combined total rate of all of the interleaved channels.
Technical Note:
For purposes of 3A001.b., the parameter peak saturated power output may also be referred to on product data sheets as output power, saturated power output, maximum power output, peak power output, or peak envelope power output.
Note 1: 3A001.b.1. does not control "vacuum electronic devices" designed or rated for operation in any frequency band and having all of the following:
Note 2: 3A001.b.1. does not control non-"space-qualified" "vacuum electronic devices" having all of the following:
Technical Note:
‘Dual mode’ means the "vacuum electronic device" beam current can be intentionally changed between continuous-wave and pulsed mode operation by use of a grid and produces a peak pulse output power greater than the continuous-wave output power.
N.B. For "MMIC" amplifiers that have an integrated phase shifter see 3A001.b.12.
Note 1: Not used.
Note 2: The control status of the "MMIC" whose rated operating frequency includes frequencies listed in more than one frequency range, as defined by 3A001.b.2.a. to 3A001.b.2.h., is determined by the lowest peak saturated power output threshold.
Note 3: Notes 1 and 2 in 3A mean that 3A001.b.2. does not control "MMICs" if they are specially designed for other applications, e.g., telecommunications, radar, automobiles.
Note 1: The control status of a transistor in 3A001.b.3.a. through 3A001.b.3.e. whose rated operating frequency includes frequencies listed in more than one frequency range, as defined by 3A001.b.3.a. to 3A001.b.3.e., is determined by the lowest peak saturated power output threshold.
Note 2: 3A001.b.3. includes bare dice, dice mounted on carriers, or dice mounted in packages. Some discrete transistors may also be referred to as power amplifiers, but the status of these discrete transistors is determined by 3A001.b.3.
N.B.1. For "MMIC" amplifiers see 3A001.b.2.
N.B.2. For ‘transmit/receive modules’ and ‘transmit modules’ see 3A001.b.12.
N.B.3. For converters and harmonic mixers, designed to extend the operating or frequency range of signal analysers, signal generators, network analysers or microwave test receivers, see 3A001.b.7.
Note 1: Not used.
Note 2: The control status of an item whose rated operating frequency includes frequencies listed in more than one frequency range, as defined by 3A001.b.4.a. to 3A001.b.4.e., is determined by the lowest peak saturated power output threshold.
Note: 3A001.b.8. does not control equipment designed or rated for operation in any frequency band which is "allocated by the ITU" for radio-communications services, but not for radio-determination.
Technical Notes:
1. To calculate the volume in 3A001.b.9.b., the following example is provided: for a maximum rated power of 20 W, the volume would be: 20 W × 10 cm3/W = 200 cm3.
2. The ‘turn-on time’ in 3A001.b.9.a. refers to the time from fully-off to fully operational, i.e., it includes the warm-up time of the MPM.
Technical Note:
In 3A001.b.10., F is the offset from the operating frequency in Hz and f is the operating frequency in MHz.
Technical Note:
A ‘frequency synthesiser’ is any kind of frequency source, regardless of the actual technique used, providing a multiplicity of simultaneous or alternative output frequencies, from one or more outputs, controlled by, derived from or disciplined by a lesser number of standard (or master) frequencies.
N.B. For general purpose "signal analysers", signal generators, network analysers and microwave test receivers, see 3A002.c., 3A002.d., 3A002.e. and 3A002.f., respectively.
Technical Notes:
1. A ‘transmit/receive module’: is a multifunction "electronic assembly" that provides bi-directional amplitude and phase control for transmission and reception of signals.
2. A ‘transmit module’: is an "electronic assembly" that provides amplitude and phase control for transmission of signals.
3. A ‘transmit/receive MMIC’: is a multifunction "MMIC" that provides bi-directional amplitude and phase control for transmission and reception of signals.
4. A ‘transmit MMIC’: is a "MMIC" that provides amplitude and phase control for transmission of signals.
5. 2,7 GHz should be used as the lowest operating frequency (fGHz) in the formula in 3A001.b.12.c. for transmit/receive or transmit modules that have a rated operation range extending downward to 2,7 GHz and below [d≤15cm*GHz*N/2,7 GHz].
6. 3A001.b.12. applies to ‘transmit/receive modules’ or ‘transmit modules’ with or without a heat sink. The value of d in 3A001.b.12.c. does not include any portion of the ‘transmit/receive module’ or ‘transmit module’ that functions as a heat sink.
7. ‘Transmit/receive modules’, or ‘transmit modules’, or ‘transmit/receive MMICs’ or ‘transmit MMICs’ may or may not have N integrated radiating antenna elements where N is the number of transmit or transmit/receive channels.
Surface acoustic wave and surface skimming (shallow bulk) acoustic wave devices, having any of the following:
Technical Note:
‘Frequency side-lobe rejection’ is the maximum rejection value specified in data sheet.
Note: 3A001.c. does not control acoustic wave devices that are limited to a single band pass, low pass, high pass or notch filtering, or resonating function.
Technical Notes:
1. For the purpose of 3A001.e.1., ‘energy density’ (Wh/kg) is calculated from the nominal voltage multiplied by the nominal capacity in ampere-hours (Ah) divided by the mass in kilograms. If the nominal capacity is not stated, energy density is calculated from the nominal voltage squared then multiplied by the discharge duration in hours divided by the discharge load in ohms and the mass in kilograms.
2. For the purpose of 3A001.e.1., a ‘cell’ is defined as an electrochemical device, which has positive and negative electrodes, an electrolyte, and is a source of electrical energy. It is the basic building block of a battery.
3. For the purpose of 3A001.e.1.a., a ‘primary cell’ is a ‘cell’ that is not designed to be charged by any other source.
4. For the purpose of 3A001.e.1.b., a ‘secondary cell’ is a ‘cell’ that is designed to be charged by an external electrical source.
5. For the purpose of 3A001.e.1.a., ‘continuous power density’ (W/kg) is calculated from the nominal voltage multiplied by the specified maximum continuous discharge current in ampere (A) divided by the mass in kilograms. ‘Continuous power density’ is also referred to as specific power.
Note: 3A001.e.1. does not control batteries, including single-cell batteries.
N.B. SEE ALSO 3A201.a. and the Military Goods Controls.
N.B. SEE ALSO 3A201.b.
Note: 3A001.e.3. does not control "superconductive" electromagnets or solenoids specially designed for Magnetic Resonance Imaging (MRI) medical equipment.
Technical Note:
‘AM0’, or ‘Air Mass Zero’, refers to the spectral irradiance of sun light in the earth's outer atmosphere when the distance between the earth and sun is one astronomical unit (AU).
Note 1: 3A001.g. includes:
Note 2: 3A001.g. does not control thyristor devices and ‘thyristor modules’ incorporated into equipment designed for civil railway or "civil aircraft" applications.
Technical Note:
For the purposes of 3A001.g., a ‘thyristor module’ contains one or more thyristor devices.
Note 1: Repetitive peak off-state voltage in 3A001.h. includes drain to source voltage, collector to emitter voltage, repetitive peak reverse voltage and peak repetitive off-state blocking voltage.
Note 2: 3A001.h. includes:
Note 3: 3A001.h. does not control switches, diodes, or ‘modules’, incorporated into equipment designed for civil automobile, civil railway or "civil aircraft" applications.
Technical Note:
For the purposes of 3A001.h., ‘modules’ contain one or more solid-state power semiconductor switches or diodes.
Note: 3A001.i. includes electro-optic modulators having optical input and output connectors (e.g., fibre-optic pigtails).
Technical Note:
For the purposes of 3A001.i., a ‘half-wave voltage’ (‘Vπ’) is the applied voltage necessary to make a phase change of 180 degrees in the wavelength of light propagating through the optical modulator.
Digital data recorders having all of the following:
Technical Notes:
1. For recorders with a parallel bus architecture, the ‘continuous throughput’ rate is the highest word rate multiplied by the number of bits in a word.
2. ‘Continuous throughput’ is the fastest data rate the instrument can record to disk or solid-state drive memory without the loss of any information while sustaining the input digital data rate or digitizer conversion rate.
Note: 3A002.a.7. does not control equivalent-time sampling oscilloscopes.
a.‘Real-time bandwidth’ exceeding 170 MHz; and
Technical Notes:
1. ‘Real-time bandwidth’ is the widest frequency range for which the analyser can continuously transform time-domain data entirely into frequency-domain results, using a Fourier or other discrete time transform that processes every incoming time point, without a reduction of measured amplitude of more than 3 dB below the actual signal amplitude caused by gaps or windowing effects, while outputting or displaying the transformed data.
2. Probability of discovery in 3A002.c.4.b.1. is also referred to as probability of intercept or probability of capture.
3. For the purposes of 3A002.c.4.b.1., the duration for 100 % probability of discovery is equivalent to the minimum signal duration necessary for the specified level measurement uncertainty.
4. A ‘frequency mask trigger’ is a mechanism where the trigger function is able to select a frequency range to be triggered on as a subset of the acquisition bandwidth while ignoring other signals that may also be present within the same acquisition bandwidth. A ‘frequency mask trigger’ may contain more than one independent set of limits.
Note: 3A002.c.4. does not control those "signal analysers" using only constant percentage bandwidth filters (also known as octave or fractional octave filters).
Technical Note:
In 3A002.d.4., F is the offset from the operating frequency in Hz and f is the operating frequency in MHz;
Technical Note:
‘RF modulation bandwidth’ is the Radio Frequency (RF) bandwidth occupied by a digitally encoded baseband signal modulated onto an RF signal. It is also referred to as information bandwidth or vector modulation bandwidth. I/Q digital modulation is the technical method for producing a vector-modulated RF output signal, and that output signal is typically specified as having an ‘RF modulation bandwidth’.
Note 1: For the purpose of 3A002.d., signal generators include arbitrary waveform and function generators.
Note 2: 3A002.d. does not control equipment in which the output frequency is either produced by the addition or subtraction of two or more crystal oscillator frequencies, or by an addition or subtraction followed by a multiplication of the result.
Technical Notes:
1. The maximum frequency of an arbitrary waveform or function generator is calculated by dividing the sample rate, in samples/second, by a factor of 2,5.
2. For the purposes of 3A002.d.1.a, ‘pulse duration’ is defined as the time interval from the point on the leading edge that is 50 % of the pulse amplitude to the point on the trailing edge that is 50 % of the pulse amplitude.
Technical Note:
‘Nonlinear vector measurement functionality’ is an instrument’s ability to analyse the test results of devices driven into the large-signal domain or the non-linear distortion range.
N.B. Digital data recorders, oscilloscopes, "signal analysers", signal generators, network analysers and microwave test receivers, are specified in 3A002.a.6., 3A002.a.7., 3A002.c., 3A002.d., 3A002.e. and 3A002.f., respectively.
Technical Notes:
1. A resolution of n bit corresponds to a quantisation of 2n levels.
2. The resolution of the ADC is the number of bits of the digital output of the ADC that represents the measured analogue input. Effective Number of Bits (ENOB) is not used to determine the resolution of the ADC.
3. For non-interleaved multiple-channel "electronic assemblies", modules, or equipment, the "sample rate" is not aggregated and the "sample rate" is the maximum rate of any single-channel.
4. For interleaved channels on multiple-channel "electronic assemblies", modules, or equipment, the "sample rates" are aggregated and the "sample rate" is the maximum combined total rate of all the interleaved channels.
Note: 3A002.h. includes ADC cards, waveform digitizers, data acquisition cards, signal acquisition boards and transient recorders.
Note: 3A101.b. above does not specify equipment specially designed for medical purposes.
Technical Notes:
1. In 3A102 ‘thermal batteries’ are single use batteries that contain a solid non-conducting inorganic salt as the electrolyte. These batteries incorporate a pyrolytic material that, when ignited, melts the electrolyte and activates the battery.
2. In 3A102 ‘missile’ means complete rocket systems and unmanned aerial vehicle systems capable of a range exceeding 300 km.
Note: 3A201.b. does not control magnets specially designed for and exported ‘as parts of’ medical nuclear magnetic resonance (NMR) imaging systems. The phrase ‘as part of’ does not necessarily mean physical part in the same shipment; separate shipments from different sources are allowed, provided the related export documents clearly specify that the shipments are dispatched ‘as part of’ the imaging systems.
Note: 3A201.c. does not control accelerators that are component parts of devices designed for purposes other than electron beam or X-ray radiation (electron microscopy, for example) nor those designed for medical purposes.
Technical Notes:
1. The ‘figure of merit’ (K) is defined as:
K = 1,7 × 103V2,65Q
V is the peak electron energy in million electron volts.
If the accelerator beam pulse duration is less than or equal to 1 μs, then Q is the total accelerated charge in Coulombs. If the accelerator beam pulse duration is greater than 1 μs, then Q is the maximum accelerated charge in 1 μs.
Q equals the integral of i with respect to t, over the lesser of 1 μs or the time duration of the beam pulse (Q = ∫ idt), where i is beam current in amperes and t is time in seconds.
2. ‘Peak power’ = (peak potential in volts) × (peak beam current in amperes).
3. In machines based on microwave accelerating cavities, the time duration of the beam pulse is the lesser of 1 μs or the duration of the bunched beam packet resulting from one microwave modulator pulse.
4. In machines based on microwave accelerating cavities, the peak beam current is the average current in the time duration of a bunched beam packet.
N.B.1. "Software" specially designed to enhance or release the performance of a frequency changer or generator to meet the characteristics of 3A225 is specified in 3D225.
N.B.2. "Technology" in the form of codes or keys to enhance or release the performance of a frequency changer or generator to meet the characteristics of 3A225 is specified in 3E225.
Note: 3A225 does not control frequency changers or generators if they have hardware, "software" or "technology" constraints that limit the performance to less than that specified above, provided they meet any of the following:
Technical Notes:
1. Frequency changers in 3A225 are also known as converters or inverters.
2. Frequency changers in 3A225 may be marketed as Generators, Electronic Test Equipment, AC Power Supplies, Variable Speed Motors Drives, Variable Speed Drives (VSDs), Variable Frequency Drives (VFDs), Adjustable Frequency Drives (AFDs), or Adjustable Speed Drives (ASDs).
Note: 3A228.a. includes gas krytron tubes and vacuum sprytron tubes.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
Note: 3A229.b. includes xenon flash-lamp drivers.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Technical Notes:
1. In 3A230, ‘pulse transition time’ is defined as the time interval between 10 % and 90 % voltage amplitude.
2. ‘Pulse heads’ are impulse forming networks designed to accept a voltage step function and shape it into a variety of pulse forms that can include rectangular, triangular, step, impulse, exponential, or monocycle types. ‘Pulse heads’ can be an integral part of the pulse generator, they can be a plug-in module to the device or they can be an externally connected device.
N.B. SEE ALSO MILITARY GOODS CONTROLS.
N.B. See 1A007.b. for detonators.
Note : 3A232 does not control detonators using only primary explosives, such as lead azide.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Technical Notes:
1. Electron bombardment mass spectrometers in 3A233.d. are also known as electron impact mass spectrometers or electron ionisation mass spectrometers.
2. In 3A233.d.2., a ‘cold trap’ is a device that traps gas molecules by condensing or freezing them on cold surfaces. For the purposes of 3A233.d.2., a closed-loop gaseous helium cryogenic vacuum pump is not a ‘cold trap’.
N.B. SEE ALSO 2B226
Note: 3B001.a.1. includes Atomic Layer Epitaxy (ALE) equipment.
Note: 3B001.e. does not control automatic robotic wafer handling systems specially designed for parallel wafer processing.
Technical Notes:
1. For the purpose of 3B001.e., ‘semiconductor process tools’ refers to modular tools that provide physical processes for semiconductor production that are functionally different, such as deposition, implant or thermal processing.
2. For the purpose of 3B001.e., ‘sequential multiple wafer processing’ means the capability to process each wafer in different ‘semiconductor process tools’, such as by transferring each wafer from one tool to a second tool and on to a third tool with the automatic loading multi-chamber central wafer handling systems.
Technical Note:
The ‘Minimum Resolvable Feature size’ (MRF) is calculated by the following formula:
where the K factor = 0,35
Note: 3B001.f.2. includes:
Note: 3B001.h. does not control multi-layer masks with a phase shift layer designed for the fabrication of memory devices not specified in 3A001.
N.B. For masks and reticles, specially designed for optical sensors, see 6B002.
Technical Note:
‘Extreme Ultraviolet’ (‘EUV’) refers to electromagnetic spectrum wavelengths greater than 5 nm and less than 124 nm.
Note: 3C001.d. does not control a "substrate" having one or more P-type epitaxial layers of GaN, InGaN, AlGaN, InAlN, InAlGaN, GaP, GaAs, AlGaAs, InP, InGaP, AlInP or InGaAlP, independent of the sequence of the elements, except if the P-type epitaxial layer is between N-type layers.
Note: 3C003 only controls compounds whose metallic, partly metallic or non-metallic element is directly linked to carbon in the organic part of the molecule.
Note: 3C004 does not control hydrides containing 20 % molar or more of inert gases or hydrogen.
Technical Note:
‘Computational lithography’ is the use of computer modelling to predict, correct, optimise and verify imaging performance of the lithography process over a range of patterns, processes, and system conditions.
Note 1: 3E001 does not control "technology" for equipment or components specified in 3A003.
Note 2: 3E001 does not control "technology" for integrated circuits specified in 3A001.a.3. to 3A001.a.12., having all of the following:
Note 3: 3E001 does not control ‘Process Design Kits’ (‘PDKs’) unless they include libraries implementing functions or technologies for items specified in 3A001.
Technical Note:
A ‘Process Design Kit’ (‘PDK’) is a software tool provided by a semiconductor manufacturer to ensure that the required design practices and rules are taken into account in order to successfully produce a specific integrated circuit design in a specific semiconductor process, in accordance with technological and manufacturing constraints (each semiconductor manufacturing process has its particular ‘PDK’).
Technical Note:
A ‘vector processor unit’ is a processor element with built-in instructions that perform multiple calculations on ‘floating-point’ vectors (one-dimensional arrays of 32-bit or larger numbers) simultaneously, having at least one vector arithmetic logic unit and vector registers of at least 32 elements each.
Technical Notes:
1. For the purpose of 3E002.a. and 3E002.b., ‘floating-point’ is defined by IEEE-754.
2. For the purpose of 3E002.c., ‘fixed-point’ refers to a fixed-width real number with both an integer component and a fractional component, and which does not include integer-only formats.
Note 1: 3E002 does not control "technology" for multimedia extensions.
Note 2: 3E002 does not control "technology" for micro-processor cores, having all of the following:
Note 3: 3E002 includes "technology" for the "development" or "production" of digital signal processors and digital array processors.
Note: 3E003.b. does not control "technology" for high electron mobility transistors (HEMT) operating at frequencies lower than 31,8 GHz and hetero-junction bipolar transistors (HBT) operating at frequencies lower than 31,8 GHz.
Technical Note:
For the purposes of 3E004 ‘SFQR’ is the range of maximum deviation and minimum deviation from front reference plane, calculated by least square method with all front surface data including site boundary within a site.
According to Article 11, listed in Annex IV part 1: this item requires an authorisation for intra-Union transfers.
Note 1: Computers, related equipment and "software" performing telecommunications or "local area network" functions must also be evaluated against the performance characteristics of Category 5, Part 1 (Telecommunications).
Note 2: Control units which directly interconnect the buses or channels of central processing units, ‘main storage’ or disk controllers are not regarded as telecommunications equipment described in Category 5, Part 1 (Telecommunications).
N.B. For the control status of "software" specially designed for packet switching, see 5D001.
Technical Note:
‘Main storage’ is the primary storage for data or instructions for rapid access by a central processing unit. It consists of the internal storage of a "digital computer" and any hierarchical extension thereto, such as cache storage or non-sequentially accessed extended storage.
N.B. SEE ALSO 4A101.
Note: 4A001.a.1. does not control computers specially designed for civil automobile, railway train or "civil aircraft" applications.
a. |
Total Dose |
5 × 103 Gy (silicon); |
b. |
Dose Rate Upset |
5 × 106 Gy (silicon)/s; or |
c. |
Single Event Upset |
1 × 10–8 Error/bit/day; |
Note: 4A001.a.2. does not control computers specially designed for "civil aircraft" applications.
Note 1: 4A003 includes the following:
Note 2: The control status of the "digital computers" and related equipment described in 4A003 is determined by the control status of other equipment or systems provided:
N.B.1. The control status of "signal processing" or "image enhancement" equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the "principal element" criterion.
N.B.2. For the control status of "digital computers" or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications).
Note 1: 4A003.c. controls only "electronic assemblies" and programmable interconnections not exceeding the limit specified in 4A003.b. when shipped as unintegrated "electronic assemblies".
Note 2: 4A003.c. does not control "electronic assemblies" specially designed for a product or family of products whose maximum configuration does not exceed the limit specified in 4A003.b.
Note: 4A003.g. does not control internal interconnection equipment (e.g. backplanes, buses), passive interconnection equipment, "network access controllers" or "communications channel controllers".
Technical Notes:
1. ‘Systolic array computers’ are computers where the flow and modification of the data is dynamically controllable at the logic gate level by the user.
2. ‘Neural computers’ are computational devices designed or modified to mimic the behaviour of a neuron or a collection of neurons, i.e., computational devices which are distinguished by their hardware capability to modulate the weights and numbers of the interconnections of a multiplicity of computational components based on previous data.
3. ‘Optical computers’ are computers designed or modified to use light to represent data and whose computational logic elements are based on directly coupled optical devices.
Note: This control only applies when the equipment is supplied with "software" specified in 7D103 or 9D103.
None.
None.
Note: The control status of "software" for equipment described in other Categories is dealt with in the appropriate Category.
Note: 4D004 does not control "software" specially designed and limited to provide "software" updates or upgrades meeting all the following:
Note 1: 4E001.a. and 4E001.c. do not control "vulnerability disclosure" or "cyber incident response".
Note 2: Note 1 does not diminish the rights of the competent authority of the EU Member State in which the exporter is established to ascertain compliance with 4E001.a. and 4E001.c.
TECHNICAL NOTE ON "ADJUSTED PEAK PERFORMANCE" ("APP")
"APP" is an adjusted peak rate at which "digital computers" perform 64-bit or larger floating point additions and multiplications.
"APP" is expressed in Weighted TeraFLOPS (WT), in units of 1012 adjusted floating point operations per second.
Abbreviations used in this Technical Note
n |
number of processors in the "digital computer" |
i |
processor number (i,...n) |
ti |
processor cycle time (ti = 1/Fi) |
Fi |
processor frequency |
Ri |
peak floating point calculating rate |
Wi |
architecture adjustment factor |
Outline of "APP" calculation method
1. For each processor i, determine the peak number of 64-bit or larger floating point operations, FPOi, performed per cycle for each processor in the "digital computer".
Note: In determining FPO, include only 64-bit or larger floating point additions or multiplications. All floating point operations must be expressed in operations per processor cycle; operations requiring multiple cycles may be expressed in fractional results per cycle. For processors not capable of performing calculations on floating point operands of 64-bit or more, the effective calculating rate R is zero.
2. Calculate the floating point rate R for each processor Ri = FPOi/ti.
3. Calculate "APP" as "APP" = W1 × R1 + W2 × R2 + … + Wn × Rn.
4. For ‘vector processors’, Wi = 0,9. For non-‘vector processors’, Wi = 0,3.
Note 1: For processors that perform compound operations in a cycle, such as addition and multiplication, each operation is counted.
Note 2: For a pipelined processor the effective calculating rate R is the faster of the pipelined rate, once the pipeline is full, or the non-pipelined rate.
Note 3: The calculating rate R of each contributing processor is to be calculated at its maximum value theoretically possible before the "APP" of the combination is derived. Simultaneous operations are assumed to exist when the computer manufacturer claims concurrent, parallel, or simultaneous operation or execution in a manual or brochure for the computer.
Note 4: Do not include processors that are limited to input/output and peripheral functions (e.g., disk drive, communication and video display) when calculating "APP".
Note 5: "APP" values are not to be calculated for processor combinations (inter)connected by "Local Area Networks", Wide Area Networks, I/O shared connections/devices, I/O controllers and any communication interconnection implemented by "software".
Note 6: "APP" values must be calculated for processor combinations containing processors specially designed to enhance performance by aggregation, operating simultaneously and sharing memory;
Technical Notes:
1. Aggregate all processors and accelerators operating simultaneously and located on the same die.
2. Processor combinations share memory when any processor is capable of accessing any memory location in the system through the hardware transmission of cache lines or memory words, without the involvement of any software mechanism, which may be achieved using "electronic assemblies" specified in 4A003.c.
Note 7: A ‘vector processor’ is defined as a processor with built-in instructions that perform multiple calculations on floating-point vectors (one-dimensional arrays of 64-bit or larger numbers) simultaneously, having at least 2 vector functional units and at least 8 vector registers of at least 64 elements each.
Category 5 - TELECOMMUNICATIONS AND "INFORMATION SECURITY" consists out of 2 parts.
Part 1 - TELECOMMUNICATIONS
Note 1: The control status of components, test and "production" equipment and "software" therefor which are specially designed for telecommunications equipment or systems is determined in Category 5, Part 1.
N.B. For "lasers" specially designed for telecommunications equipment or systems, see 6A005.
Note 2: "Digital computers", related equipment or "software", when essential for the operation and support of telecommunications equipment described in this Category, are regarded as specially designed components, provided they are the standard models customarily supplied by the manufacturer. This includes operation, administration, maintenance, engineering or billing computer systems.
Part 2 - "INFORMATION SECURITY"
Note 1: Not used.
Note 2: Category 5, Part 2 does not control products when accompanying their user for the user’s personal use.
Note 3: Cryptography Note
5A002, 5D002.a.1., 5D002.b. and 5D002.c.1. do not control items as follows:
For the purpose of the Cryptography Note, ‘executable software’ means "software" in executable form, from an existing hardware component excluded from 5A002 by the Cryptography Note.
Note: ‘Executable software’ does not include complete binary images of the "software" running on an end-item.
Note to the Cryptography Note:
1. To meet paragraph a. of Note 3, all of the following must apply:
2. In determining eligibility of paragraph a. of Note 3, competent authorities may take into account relevant factors such as quantity, price, required technical skill, existing sales channels, typical customers, typical use or any exclusionary practices of the supplier.
Note 1: 5A001.a.3. and 5A001.a.4. control only electronic equipment.
Note 2: 5A001.a.2., 5A001.a.3. and 5A001.a.4. do not control equipment designed or modified for use on board satellites.